- 產(chǎn)品詳情
應(yīng)用領(lǐng)域：基站、RFID和其他天線設(shè)計(jì)。
| Standard Thicknesses | Standard Panel Sizes: | Standard Cladding | |
| R04725JXR LoPro 0.0307"(0.780 mm)+/-0.0020” 0.0607"(1.542 mm)+/-0.0040” 0.0200"(0.508mm)+/-0.0015”0.0300"(0.762 mm)+/-0.0020”0.0600"(1.524mm)+/-0.0040" | R04730G3 LoPro 0.0057”(0.145mm)+/-0.0007” 0.0107”(0.272mm)+/-0.0010” 0.0207”(0.526mm)+/-0.0015” 0.0307”(0.780mm)+-0.0020” 0.0607”(1.542mm)+/-0.0040” | 24*X18"(610X457mm) 24"X21"(610X533 mm) 24"X36"(610X915 mm) 48"X36"(1219X915 mm) *Additional panel sizesavailable | Electrodeposited Copper Foil ?oz(18μm)HH/HH 1oz(35μm)H1/H1 ?oz(18μm)TH/TH 10z(35μm)Ti/T1 |
主要特性：
低損耗電介質(zhì)與薄型銅箔結(jié)合，減少無(wú)源互調(diào)(PIM)和低插入損耗。
采用中空微球填料的熱固性樹(shù)脂系統(tǒng)，使層壓板輕質(zhì)且低密度，重量比玻璃纖維聚四氟乙烯材料輕約30%。
提供RO4725JXR?(2.55Dk)和RO4730JXR?(3.0 DK)兩種型號(hào)，成本較低。
低Z軸熱膨脹系數(shù)(CTE)<30 PPM/oC，設(shè)計(jì)靈活性高。
溫度系數(shù)介電常數(shù)(TCDk)<40 PPM/oC，電路性能穩(wěn)定。
高玻璃化轉(zhuǎn)變溫度(Tg)高于280oC，與無(wú)鉛和自動(dòng)化裝配兼容。
制造兼容性：符合RoHS標(biāo)準(zhǔn)，與標(biāo)準(zhǔn)PCB制造技術(shù)和電鍍通孔(PTH)工藝兼容。
環(huán)保特性：專有的無(wú)鹵素層壓板，支持更長(zhǎng)的鉆具壽命，降低制造成本。
規(guī)格參數(shù)：
| Property | Typical Value R04725JXR | TypicalValu eR04730G3 | Direction | Units | Condition | Test Method |
| Dielectric Constant,e.Process | 2.55±0.05 | 3.00±0.05 | Z | 10 GHz/23℃ | IPC-TM-650,2.5.5.5 | |
| DielectricConstant,e,Design [3] | 2.64 | 2.98 | Z | 1.7 GHz-5 GHz | Differential Phase Length Method | |
| Dissipation Factor [4] | 0.0026 | 0.0028 | Z | 10 GHz/23℃ | IPC-TM-650,2.5.5.5 | |
| 0.0022 | 2.5GHz | |||||
| Thermal Coeffcient of s | +34 | +34 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650,2.5.5.5 |
| Volume Resistivity(0.030") | 2.16X10 | 9.0X10 | MQ-cm | COND A | IPC-TM-650,2.5.17.1 | |
| Surface Resistivity (0.030") | 4.8X107 | 7.2X10? | MQ | COND A | IPC-TM-650,2.5.17.1 | |
| PIM [2] | -166 | -165 | dBc | 50 ohm 0.060" | 43dBm 1900MHz | |
| Electrical Strength (0.030" | 630 | 730 | Z | V/mil | IPCTM-650,2.5.6.2 | |
| Flexural Strength MD | 121(17.5) | 181(26.3) | MPa (kpsi) | RT | ASTM D790 | |
| CMD | 92(13.3) | 139(20.2) | ||||
| Dimensional Stability | <0.4 | <0.4 | X,Y | mm/m | after etch +E2/150℃ | IPC-TM-650,2.4.39A |
| Coefficient ofThermal Expansion | 13.9 | 15.9 | X | ppm/℃ | -55 T0288℃ | PC-TM-650,2.1.24 |
| 19.0 | 14.4 | Y | ||||
| 25.6 | 35.2 | Z | ||||
| Thermal Conductivity | 0.38 | 0.45 | Z | W/mK | 50℃ | ASTM D5470 |
| Moisture Absorption | 0.24% | 0.093 | % | 48/50 | IPC-TM-6502.6.2.1 ASTM D570 | |
| Tg | >280 | >280 | ℃ | IPC-TM-6502.4.24 | ||
| Td | 439 | 411 | ℃ | ASTM D3850 | ||
| Density | 1.27 | 1.58 | gm/cm3 | ASTM D792 | ||
| Copper Peel Strength | 8.5 | 4.1 | pli | 1 ozLoPro EDC | PC-TM-6502.4.8 | |
| Flammability | N/A | V-0 | UL94 | |||
| Lead-Free ProcessCompatible | YES | Yes |
